Semiconductor device having a base metal lead frame

Details Semiconductor device having a base metal lead frame Semiconductor device having a base metal lead frame

2005-02-08

2005-02-08

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S693000, C257S784000

Reexamination Certificate

active

06853056

ABSTRACT:
Disclosed is a semiconductor device which has a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad, copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires; wherein an initial detachment area of said resin molded member at the bottom side of the die pad is 20% or less to the whole die pad area.

REFERENCES:
patent: 5818105 (1998-10-01), Kouda
patent: 6518652 (2003-02-01), Takata et al.
patent: 20030116842 (2003-06-01), Motonami et al.
patent: 60-211953 (1985-10-01), None
patent: 61-208246 (1986-09-01), None
patent: 5-102374 (1993-04-01), None
patent: 5-347320 (1993-12-01), None
patent: 9-74159 (1997-03-01), None
patent: 2001-237262 (2001-08-01), None
Huneke, “Die Attach Adhesion on Leadframes Treated with Antioxidants”, IEEE/CPMT Electronic Packaging Technology Conference, 1997, pp. 208-214.

Affiliated with

Also associated with

Rating

Semiconductor device having a base metal lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a base metal lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a base metal lead frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3503621