Semiconductor device having a ball grid array and a...

Details Semiconductor device having a ball grid array and a... Semiconductor device having a ball grid array and a...

2006-06-20

2006-06-20

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S462000

Reexamination Certificate

active

07064047

ABSTRACT:
A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

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