Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-09-22
1998-03-24
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257669, 257674, 257691, 174 524, H01L 23495, H01L 23522
Patent
active
057319626
ABSTRACT:
A semiconductor chip mounted on an island is electrically connected to inner leads through tape-automated bonding leads supported by an insulating suspender tape, and a support ring is connected between the insulating suspender tape and suspender pins connected to the island so as to maintain an original relative position between the semiconductor chip and the tape-automated bonding leads during a molding stage.
REFERENCES:
patent: 4951120 (1990-08-01), Hagiwara et al.
"Development of Ultra Fine QFP", NEC Technical Report, vol. 47, No. Mar. 1994, pp. 34-37.
NEC Corporation
Picard Leo P.
Vigushin John B.
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