Semiconductor device for use in a large scale integration circui

Details Semiconductor device for use in a large scale integration circui Semiconductor device for use in a large scale integration circui

1984-03-14

1986-12-23

James, Andrew J.

357 65, 357 231, 357 45, 357 71, H01L 2348, H01L 2944, H01L 2978, H01L 2710

Patent

active

046315713

ABSTRACT:
An output signal is derived from an output buffer to an external lead in a semiconductor device. In general, the output buffer is constructed using an MOS transistor and is located near a bonding pad on the chip. Therefore, the number of bonding pads which can be formed on the chip is limited by the output buffer space. The present invention provides the output buffer with a tapered or tiered shape which reduces the pitch between bonding pads. Thus, a large number of bonding pads (output buffers) can be integrated in a semiconductor chip according to the present invention.

REFERENCES:
patent: 3652906 (1972-03-01), Christensen
patent: 3878550 (1975-04-01), Benjamin
patent: 4499484 (1985-02-01), Tanizawa et al.
patent: 4511914 (1985-04-01), Remedi et al.
patent: 4568961 (1986-02-01), Noto

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