Semiconductor device for reducing the number of probing pad...

Details Semiconductor device for reducing the number of probing pad... Semiconductor device for reducing the number of probing pad...

2006-02-21

2006-02-21

Karlsen, Ernest (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010

Reexamination Certificate

active

07002364

ABSTRACT:
The present invention relates to a semiconductor device and a method for testing the same capable of reducing the number of probing pads used during wafer test. The semiconductor device includes a select circuit connected between a plurality of internal circuits to be tested and a single probing pad, for transmitting test signals inputted from the probing pads to any one of the plurality of the internal circuits according to a test mode signal generated in a wafer test mode. It is possible to reduce the number of the probing pads in the integrated circuit used for connection to a probe for contact of a probe card during wafer test. It is therefore possible to reduce test time.

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patent: 2000-0014072 (2000-03-01), None
Office Action from the Korean Patent Office dated Apr. 18, 2005 (3 pages).

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