Semiconductor device for mounting on a printed wiring board

Details Semiconductor device for mounting on a printed wiring board Semiconductor device for mounting on a printed wiring board

1994-05-05

1995-07-04

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257724, 257691, 361735, 361760, H01L 25065, H01L 2348

Patent

active

054303265

ABSTRACT:
A semiconductor device includes at least one semiconductor element contained in a casing, with main terminals and auxiliary terminals drawn from the semiconductor electrodes disposed on the upper face of the casing. The main terminals and the auxiliary terminals are arranged on the same plane at the same height without disposing partitions between the terminals so that the devices can be mounted on a printed wiring board on which the necessary conductor patterns for the main circuit have already been formed. In an alternative embodiment, the main terminals are arranged at a level slightly higher than the auxiliary terminals with the auxiliary terminals being surrounded by a supporting guide.

REFERENCES:
patent: 4885629 (1989-12-01), Takagi
IBMTDB, Doo, V. Y., Liquid Metal Multihead Connector vol. 20, No. 11B, Apr. 1978, pp 4789-4790.

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