Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-06-05
1999-07-13
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257717, 257723, H01L 2334
Patent
active
059230843
ABSTRACT:
A semiconductor device comprising a low-heat-resistance heat discharging route suitable for small semiconductor devices, such as an IC card, is disclosed. Heat arising from electronic parts is efficiently dispersed to the outside, thereby accomplishing a decrease in size and a heightening of function. In a specific embodiment, a CPU is mounted on a substrate in a position of thermal via holes. A high-heat-conducting material such as semifluid silicone rubber is placed between a CPU mounting face of the substrate and lower panel located on the opposite side of the substrate. The high-heat-conducting material is a filler having the ability to change shape and the property of electrical nonconductivity. A greater part of the heat arising from the CPU is transmitted through the thermal via holes from the CPU mounting face of the substrate to the opposite side, and further to the high-heat-conducting material which conveys the heat to the lower panel. The heat is dispersed from the lower panel surface directly into the atmosphere.
REFERENCES:
patent: 4396936 (1983-08-01), McIver et al.
patent: 5285352 (1994-02-01), Pastori et al.
patent: 5506755 (1996-04-01), Miyagi et al.
patent: 5552635 (1996-09-01), Kim et al.
patent: 5625227 (1997-04-01), Estes et al.
Disclosure 26519, Research Disclosure, May 1986, #265; Ken. Mason Pub. Ltd.
Cherniack et al; IBM Tech. Disc. Bull., vol. 8, No. 10, Mar. 1966.
"High Efficiency Radiation Hole With Metal Core Printed Wiring Board," IBM Tech. Disc. Bull.; vol. 33, No. 7; Nov. 1990.
Inoue Kazuaki
Nakamura Norio
Yamashita Hiroyuki
Yoda Hiroyuki
Chaudhuri Olik
Kelley Nathan K.
Seiko Epson Corporation
LandOfFree
Semiconductor device for heat discharge does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device for heat discharge, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device for heat discharge will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2278185