Amplifiers – With semiconductor amplifying device – Including temperature compensation means
Patent
1996-09-11
1998-06-23
Mullins, James B.
Amplifiers
With semiconductor amplifying device
Including temperature compensation means
330307, H03F 3183
Patent
active
057709734
ABSTRACT:
A semiconductor device for amplifying audio signals of the present invention comprises a preamplifier chip for amplifying small signals representing audio signals; a power amplifier chip which receives and power-amplifies the amplified audio signals from the preamplifier chip and outputs the same ; and a frame where the preamplifier chip and the power amplifier chip are mounted and which includes a heat sink area connected to a terminal for heat radiation, wherein the heat sink area is located adjacent to an area in the frame where the power amplifier chip is mounted, and the preamplifier chip, the power amplifier chip and the frame are packaged together.
REFERENCES:
patent: 3667064 (1972-05-01), Thornton et al.
Fujisawa Masanori
Horiuchi Sachito
Nakagawa Eiji
Mullins James B.
Rohm & Co., Ltd.
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