Semiconductor device fabrication method and pattern...

Details Semiconductor device fabrication method and pattern... Semiconductor device fabrication method and pattern...

2008-01-23

2010-12-21

Ewald, Maria Veronica D (Department: 1791)

Plastic article or earthenware shaping or treating: apparatus

Preform reshaping or resizing means: or vulcanizing means...

Surface deformation means only

C425S174400, C264S293000

Reexamination Certificate

active

07854604

ABSTRACT:
According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material.

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Yoneda, “Pattern forming template and pattern forming method”, U.S. Appl. No. 11/866,538, filed Oct. 3, 2007.

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