Semiconductor device fabrication

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29571, 29580, 29591, 148178, H01L 2124

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active

043790054

ABSTRACT:
Semiconductor devices can be fabricated using as an intermediate manufacturing structure a substrate of one semiconductor with a thin epitaxial surface layer of a different semiconductor with properties such that the semiconductors each have different solubilities with respect to a metal. When a vertical differentiation is used to expose the different materials and the metal is deposited on both and heated, the metal will form a Schottky barrier in one material and an ohmic contact in the other. Where the substrate is gallium arsenide and the epitaxial layer is gallium aluminum arsenide and the metal is tin, a self-aligned gallium arsenide MESFET is formed wherein the tin forms ohmic contacts with the gallium arsenide and a Schottky barrier contact with the gallium aluminum arsenide.

REFERENCES:
patent: 3562606 (1971-02-01), Heer et al.
patent: 3612958 (1971-10-01), Saito et al.
patent: 3675313 (1972-07-01), Driver et al.
patent: 3678573 (1972-07-01), Driver
patent: 3767482 (1973-10-01), Kock et al.
patent: 3886580 (1975-05-01), Calviello
patent: 3896473 (1975-07-01), DiLorenzo et al.
patent: 3904449 (1975-09-01), DiLorenzo et al.
patent: 3912546 (1975-10-01), Hunsperger et al.
patent: 3914784 (1975-10-01), Hunsperger et al.
patent: 3986192 (1976-10-01), DiLorenzo et al.
patent: 4048712 (1977-09-01), Buiatti
patent: 4075652 (1978-02-01), Umebachi et al.
patent: 4122476 (1978-10-01), Hovel et al.
patent: 4160984 (1979-07-01), Ladd et al.
patent: 4173063 (1979-11-01), Kniepkamp et al.
patent: 4236166 (1980-11-01), Cho et al.
patent: 4255755 (1981-03-01), Itoh et al.
patent: 4313971 (1982-02-01), Wheatley
Dumke et al., IBM Technical Disclosure Bulletin, vol. 14, No. 4, Sep. 1971, pp. 1248 and 1249.
Ladd et al., Solid-State Electronics, vol. 13, Pergamon Press, 1970, Gt. Britain, pp. 485-489.

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