Semiconductor device fabricating system

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means

Reexamination Certificate

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Details

C156S345320, C156S916000, C118S713000, C118S719000, C414S935000

Reexamination Certificate

active

07972468

ABSTRACT:
A semiconductor device fabricating system1includes a casing 10, processing units12,13and14,for carrying out semiconductor device fabricating processes, disposed inside the casing, and platforms15,16and17set outside the casing. The platforms are foldable. Spaces required by the platforms can be reduced and the footprint of the semiconductor device fabricating system can be reduced by folding the platforms.

REFERENCES:
patent: 5443642 (1995-08-01), Bienduga
patent: 5695207 (1997-12-01), Mouterde et al.
patent: 6473151 (2002-10-01), Deguchi
patent: 2004/0226510 (2004-11-01), Hanson et al.
patent: 2002-134588 (2002-05-01), None

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