Semiconductor device encapsulation method

Details Semiconductor device encapsulation method Semiconductor device encapsulation method

1993-10-01

1994-10-25

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 522, 174 524, 26427215, 427 96, H05K 334

Patent

active

053576730

ABSTRACT:
In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bonds (27), connect the semiconductor device to conductor paths (28) on the base within the cavity. An encapsulation material comprising a thixotropic fluorosiloxane material (51; 61) is applied in the cavity and completely covers the semiconductor device and the electrical connections. This structure enables the semiconductor device to withstand typical automotive contaminants, such as mild acids and gasoline, while also preventing erratic semiconductor device operation due to bubbles which may be drawn into the encapsulation material.

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IBM Tech Disclosure Bulletin vol. 7, No. 10, Mar. 1965, p. 860 by S. Merrin et al.

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