Semiconductor device encapsulation

Details Semiconductor device encapsulation Semiconductor device encapsulation

2001-02-21

2008-10-21

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Having organic semiconductive component

C438S127000

Reexamination Certificate

active

07439096

ABSTRACT:
An encapsulated semiconductor device and method wherein an encapsulant material is deposited on the device in an environment that enhances device performance. Illustrative encapsulant materials are organic polymers, silicon polymers and metal/polymer-layered encapsulants. Encapsulant formation environments may include inert, reducing and ammonia gas environment. Further disclosed are an encapsulated transistor and a semiconductor device.

REFERENCES:
patent: 4017495 (1977-04-01), Jaffe et al.
patent: 4960656 (1990-10-01), Chang et al.
patent: 4963012 (1990-10-01), Tracy et al.
patent: 5010024 (1991-04-01), Allen et al.
patent: 5162892 (1992-11-01), Hayashi et al.
patent: 5439849 (1995-08-01), McBride et al.
patent: 5854141 (1998-12-01), Cronin et al.
patent: 5923964 (1999-07-01), Li
patent: 5946551 (1999-08-01), Dimitrakopoulos et al.
patent: 6093583 (2000-07-01), Mukerji et al.
patent: 6103541 (2000-08-01), Yang et al.
patent: 6181569 (2001-01-01), Chakravorty
patent: 6340789 (2002-01-01), Petritsch et al.
patent: 6376360 (2002-04-01), Cha et al.
patent: 6403397 (2002-06-01), Katz
patent: 6429450 (2002-08-01), Mutsaers et al.
patent: 6528816 (2003-03-01), Jackson et al.
patent: 6544908 (2003-04-01), Weimer et al.
patent: 6621098 (2003-09-01), Jackson et al.
patent: WO 98/05072 (1998-02-01), None
Klaux et al. “Pentacene Thin Film Transistor and Inverter Circuits”, Jul. 1997, IEEE, pp. 20.7.1-20.7.4.
Zhenan Bao, et al., “Soluble and Processable Regioregular Poly (3-hexylthiophene) for Thin Film Field-effect Transistor Applications with High mobility”,Applied Physics Letter, vol. 69, p. 4108-4110, 1996.

Affiliated with

Also associated with

Rating

Semiconductor device encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device encapsulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3989945