Semiconductor device-encapsulating epoxy resin composition conta

Details Semiconductor device-encapsulating epoxy resin composition conta Semiconductor device-encapsulating epoxy resin composition conta

1994-09-28

1995-12-19

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525109, 525122, 525476, 525481, 525482, 525487, 528 27, C08L 6300, C08K 708

Patent

active

054768845

ABSTRACT:
Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

REFERENCES:
patent: 4639476 (1987-01-01), Tajiri et al.
patent: 4701479 (1987-10-01), Shiobara et al.
patent: 4720515 (1988-01-01), Iji et al.

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