Semiconductor device-encapsulating epoxy resin composition

Details Semiconductor device-encapsulating epoxy resin composition Semiconductor device-encapsulating epoxy resin composition

1994-10-25

1996-10-22

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523457, 523458, 523459, 523466, 523481, 523482, 523485, 523486, 523487, 528104, C08L 6300

Patent

active

055677495

ABSTRACT:
A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.

REFERENCES:
patent: 4874669 (1989-10-01), Larson et al.

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