Semiconductor device encapsulated with an epoxy resin and a proc

Details Semiconductor device encapsulated with an epoxy resin and a proc Semiconductor device encapsulated with an epoxy resin and a proc

1995-06-05

1996-10-01

Wilson, D. R.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

428209, 525507, 528 98, 528153, 26427217, B32B 1508, B29C 3900, C08G 5908, C08L 6304

Patent

active

055609686

ABSTRACT:
A process for encapsulating a semiconductor device involves the step(s) of encapsulating the device with an epoxy resin composites represented by the formula (2) ##STR1## in which R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.

REFERENCES:
patent: 1873849 (1932-08-01), Moss
patent: 2844553 (1958-07-01), Taylor et al.
patent: 3829401 (1974-08-01), Futaki
patent: 4550128 (1985-10-01), Chellis
Ganesan et al, "Model and Analysis for Solder Reflow Cracking Phenomenon in SMT Plastic Packages", IEEE, 1993, pp. 653-660.
Fujita et al, "High-Reliability Epoxy Molding Compound for Surface Mount Devices", IEEE, 1993, pp. 735-741.
Golwalkar et al, "Moisture Sensitivity of Thin Small Outline Packages", IEEE, 1991, pp. 745-749.
Erich et al, Effect of Molecular Structure on Mechanical Properties of Epoxy Resins, Journal of Applied Polymer Science III: 296 (1960).

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