Semiconductor device encapsulant consisting of epoxy resin compo

Details Semiconductor device encapsulant consisting of epoxy resin compo Semiconductor device encapsulant consisting of epoxy resin compo

1989-09-12

1991-11-26

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523436, 525 65, 525 68, C08K 336, C08G 6391

Patent

active

050682679

ABSTRACT:
An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains

REFERENCES:
patent: 4529755 (1985-07-01), Nishikawa et al.
patent: 4720515 (1988-01-01), Iji et al.
patent: 4902273 (1990-02-01), Itoh et al.
patent: 4904761 (1990-02-01), Okitsu et al.
patent: 4916174 (1990-04-01), Yoshizumi et al.

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