Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-04-08
1998-11-10
Prenty, Mark V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257 81, 257433, H01L 2334
Patent
active
058348417
ABSTRACT:
Disclosed are semiconductor devices employing chips comprising highly integrating semiconductor elements, and having various means for controlling temperature increase of the chips. These means comprise three approaches: means for controlling heat generation by adjusting clock frequencies to be supplied to the chips respectively; means for suppressing heat generation by suitably arranging the wiring construction of the chip substrate; and means for suppressing heat generation of sub-chips by a parallel process such as optical communication between the sub-chips.
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Kabushiki Kaisha Toshiba
Prenty Mark V.
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