Semiconductor device employing an aluminum clad leadframe

Details Semiconductor device employing an aluminum clad leadframe Semiconductor device employing an aluminum clad leadframe

1993-08-03

1994-07-12

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257677, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053291590

ABSTRACT:
A quad leadframe (22') for a CERQUAD is manufactured using conventional cladding and stamping technologies. A first metal layer (12) is provided with multiple cavities (14). A second metal layer (14) is clad to the first metal layer. A leadframe strip (22) can then be stamped from the clad metal. The leadframe has a leads (24) and bonding posts (28). The leads comprise two metal layers, and the bonding posts comprise only the second metal layer. The leadframe can then be used in the assembly of a semiconductor device (32). The portion of the leads external to the package body can be optionally etched to remove the second metal layer.

REFERENCES:
patent: 4554404 (1985-11-01), Gilder, Jr. et al.
patent: 4651415 (1987-03-01), Frampton
patent: 4663650 (1987-05-01), Gilder, Jr. et al.
patent: 4663651 (1987-05-01), Gilder, Jr. et al.
patent: 4805009 (1989-02-01), Pryor et al.
patent: 4820658 (1989-04-01), Gilder, Jr. et al.
patent: 4872260 (1989-10-01), Johnson et al.
patent: 4951119 (1990-08-01), Yonemochi et al.

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