Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2006-02-15
2008-10-14
Hoang, Quoc D (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C438S107000, C257SE23042, C257SE21499
Reexamination Certificate
active
07436061
ABSTRACT:
A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to extend off the first semiconductor package.
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Japanese Language Office Action lists the reference above.
Hoang Quoc D
Hogan & Hartson LLP
Seiko Epson Corporation
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