Semiconductor device, electronic device, electronic...

Details Semiconductor device, electronic device, electronic... Semiconductor device, electronic device, electronic...

2007-06-12

2007-06-12

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S723000, C257S725000, C257S777000, C257S778000

Reexamination Certificate

active

10774347

ABSTRACT:
A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes onto lands, which are formed on a first carrier substrate, second and third carrier substrates are mounted on the first carrier substrate such that ends of the second and third carrier substrates are arranged above a semiconductor chip.

REFERENCES:
patent: 5120678 (1992-06-01), Moore et al.
patent: 5222014 (1993-06-01), Lin
patent: 5608262 (1997-03-01), Degani et al.
patent: 5656856 (1997-08-01), Kweon
patent: 5677569 (1997-10-01), Choi et al.
patent: 5755374 (1998-05-01), Prigmore
patent: 5834848 (1998-11-01), Iwasaki
patent: 5973392 (1999-10-01), Senba et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6023097 (2000-02-01), Chiang et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6034425 (2000-03-01), Chiang et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6121682 (2000-09-01), Kim
patent: 6122171 (2000-09-01), Akram et al.
patent: 6229215 (2001-05-01), Egawa
patent: 6239383 (2001-05-01), Lin
patent: 6239496 (2001-05-01), Asada
patent: 6288445 (2001-09-01), Kimura
patent: 6369444 (2002-04-01), Degani et al.
patent: 6369448 (2002-04-01), McCormick
patent: 6404049 (2002-06-01), Shibamoto et al.
patent: 6413798 (2002-07-01), Asada
patent: 6414391 (2002-07-01), Corisis et al.
patent: 6442026 (2002-08-01), Yamaoka
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6489678 (2002-12-01), Joshi
patent: 6493229 (2002-12-01), Akram et al.
patent: 6507098 (2003-01-01), Lo et al.
patent: 6528871 (2003-03-01), Tomita
patent: 6564454 (2003-05-01), Glenn et al.
patent: 6573119 (2003-06-01), Hirashima et al.
patent: 6586832 (2003-07-01), Shibata et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6590282 (2003-07-01), Wang et al.
patent: 6600221 (2003-07-01), Kimura
patent: 6610560 (2003-08-01), Pu et al.
patent: 6611063 (2003-08-01), Ichinose et al.
patent: 6614104 (2003-09-01), Farnworth et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6710455 (2004-03-01), Goller et al.
patent: 6717244 (2004-04-01), Hikita et al.
patent: 6717251 (2004-04-01), Matsuo et al.
patent: 6727582 (2004-04-01), Shibata
patent: 6731009 (2004-05-01), Jones et al.
patent: 6774467 (2004-08-01), Horiuchi et al.
patent: 6781241 (2004-08-01), Nishimura et al.
patent: 6787916 (2004-09-01), Halahan
patent: 6828665 (2004-12-01), Pu et al.
patent: 6833613 (2004-12-01), Akram et al.
patent: 6882232 (2005-04-01), Harima
patent: 6903458 (2005-06-01), Nathan
patent: 6914259 (2005-07-01), Sakiyama et al.
patent: 2001/0015488 (2001-08-01), Akram et al.
patent: 2001/0026013 (2001-10-01), Mess et al.
patent: 2002/0017709 (2002-02-01), Yanagisawa et al.
patent: 2002/0027275 (2002-03-01), Fujimoto et al.
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 2002/0096753 (2002-07-01), Tu et al.
patent: 2002/0163075 (2002-11-01), Ho et al.
patent: 2002/0167079 (2002-11-01), Pu et al.
patent: 2003/0022465 (2003-01-01), Wachtler
patent: 2003/0089977 (2003-05-01), Chee et al.
patent: 2003/0127719 (2003-07-01), Chang
patent: 2003/0137041 (2003-07-01), Blackshear et al.
patent: 2003/0141582 (2003-07-01), Yang et al.
patent: 2004/0104469 (2004-06-01), Yagi et al.
patent: 2004/0124520 (2004-07-01), Rinne
patent: 2004/0135243 (2004-07-01), Aoyagi
patent: 2004/0212071 (2004-10-01), Moshayedi
patent: 2004/0222510 (2004-11-01), Aoyagi
patent: 2004/0238954 (2004-12-01), Miyaji et al.
patent: 06-013541 (1994-01-01), None
patent: 07-183426 (1995-07-01), None
patent: 09-092685 (1997-04-01), None
patent: 09-283697 (1997-10-01), None
patent: 10-084076 (1998-03-01), None
patent: 10-284683 (1998-10-01), None
patent: 10-340928 (1998-12-01), None
patent: 11-307717 (1999-11-01), None
patent: 2000-040713 (2000-02-01), None
patent: 2001-015633 (2001-01-01), None
patent: 2001-44362 (2001-02-01), None
patent: 2001-110979 (2001-04-01), None
patent: 2001-223297 (2001-08-01), None
patent: 2002-057273 (2002-02-01), None
patent: 2002-134661 (2002-03-01), None
patent: 2002-261232 (2002-09-01), None
patent: 2002-329813 (2002-11-01), None
patent: 2002-353272 (2002-12-01), None
patent: 2004-079923 (2004-03-01), None
patent: 2004-265955 (2004-09-01), None
patent: 2004-273938 (2004-09-01), None
Communication from Japanese Patent Office re: counterpart application.
Communication from Japanese Patent Office re: counterpart application.
Communication from Japanese Patent Office regarding counterpart application.

Affiliated with

Also associated with

Rating

Semiconductor device, electronic device, electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, electronic device, electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, electronic device, electronic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3825582