Semiconductor device, electronic device and fabrication...

Details Semiconductor device, electronic device and fabrication... Semiconductor device, electronic device and fabrication...

2007-01-19

2010-10-26

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S529000, C257SE23149

Reexamination Certificate

active

07821134

ABSTRACT:
A semiconductor device includes a lower pad layer, an insulating layer and an upper pad layer. The lower pad layer is provided on a semiconductor substrate. The insulating layer is away from a surrounding of the lower pad layer so that a space having a recess on a surface between the lower pad layer and the insulating layer is formed. The upper pad layer covers over the lower pad layer and the space, extends to an upper face of the insulating layer, and has an area larger than that of the lower pad layer.

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European Search Report dated Jul. 12, 2007.
Taiwanese Notice of Allowance dated Jun. 4, 2010 with a Search Report (with partial English translation).

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