Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2006-08-07
2008-10-07
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257SE23021, C257SE23064, C257SE23146, C257SE25011, C257S737000, C257S738000, C257S778000, C257S690000, C257S698000, C257S673000, C257S784000
Reexamination Certificate
active
07432585
ABSTRACT:
A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a connection terminal provided on or above the active face of the semiconductor substrate.
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“The Technology and Development of System in Package”, Long LE, China Academic Journal Electronic Publishing House, pp. 15-19, Mar. 31, 2004 (with English translation).
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
Williams Alexander O
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