Semiconductor device design and process

Metal working – Method of mechanical manufacture – Assembling or joining

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29576B, 29578, 29579, 148 15, 357 15, 357 22, H01L 21265, H01L 21302

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044033966

ABSTRACT:
A method for fabricating a gate-source structure for a recessed-gate static induction transistor. Source impurities are implanted prior to forming the recessed gates. The recessed gates are formed by a first isotropic etching step and a second anisotropic etching step which results in a unique overhanging protective layer used to protect the walls of the grooves during implantation of gate impurities in the bottom of the grooves. Implantations are driven and activated to form gate and source regions, the protective layer is removed and metal deposited to form electrodes. The procedure minimizes the required number of masking steps and associated mask registration problems.

REFERENCES:
patent: 3755001 (1973-08-01), Kooi
patent: 3938241 (1976-02-01), George
patent: 3999281 (1976-12-01), Goronkin
patent: 4115793 (1978-09-01), Nishizawa
patent: 4140558 (1979-02-01), Murphy
patent: 4262296 (1981-04-01), Shealy
patent: 4315782 (1982-02-01), Tarng
patent: 4326209 (1982-04-01), Nishizawa
patent: 4329772 (1982-05-01), Oikawa
patent: 4356211 (1982-10-01), Riseman
"High-Frequency High-Power Static Induction Transistor", Nishizawa et al., IEEE Transactions on Electron Devices, vol. Ed-25, No. 3, Mar. 1978, 9 pp.
"Recessed Gate Junction Field Effect Transistors", Baliga, International Electron Devices Meeting, IEEE, Dec. 8-9-10, 1980, Wash. D. C., 3 pp.

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