Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2007-10-09
2007-10-09
Leo, Leonard R. (Department: 3744)
Heat exchange
With retainer for removable article
Electrical component
C165S170000, C257S714000, C361S699000
Reexamination Certificate
active
11000897
ABSTRACT:
In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.
REFERENCES:
patent: 3882934 (1975-05-01), Knoos et al.
patent: 3909118 (1975-09-01), Schmidt
patent: 3923383 (1975-12-01), Engel et al.
patent: 4260015 (1981-04-01), Tamburini
patent: 4411311 (1983-10-01), Touze
patent: 4450896 (1984-05-01), Opitz et al.
patent: 4489570 (1984-12-01), Little
patent: 4909315 (1990-03-01), Nelson et al.
patent: 5056127 (1991-10-01), Iversen et al.
patent: 5761037 (1998-06-01), Anderson et al.
patent: 6014312 (2000-01-01), Schulz-Harder et al.
patent: 6796370 (2004-09-01), Doll
patent: 10-246531 (1998-09-01), None
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