Semiconductor device containing stacked semiconductor chips...

Details Semiconductor device containing stacked semiconductor chips... Semiconductor device containing stacked semiconductor chips...

2004-09-28

2008-07-29

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S753000, C257S780000, C257S781000, C257SE21143, C257SE21218, C257SE21311

Reexamination Certificate

active

07405484

ABSTRACT:
An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.

REFERENCES:
patent: 3918149 (1975-11-01), Roberts
patent: 4908094 (1990-03-01), Jones et al.
patent: 5485038 (1996-01-01), Licari et al.
patent: 6046500 (2000-04-01), Fey et al.
patent: 6593658 (2003-07-01), Huang et al.
patent: 6828604 (2004-12-01), Inoue
patent: 6853060 (2005-02-01), Seok et al.
patent: 6921860 (2005-07-01), Peterson et al.
patent: 6936927 (2005-08-01), Igarashi et al.
patent: 07-183426 (1995-07-01), None
patent: 2000-039451 (2000-02-01), None
patent: 2000-216297 (2000-08-01), None
patent: 2002-270640 (2002-09-01), None
patent: 2002-334880 (2002-11-01), None
patent: 2002-85803 (2002-11-01), None

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