Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-11-21
1998-07-07
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, 257696, 257693, 257692, 257735, H01L 2300, H01L 2312, H01L 2348, H01L 2944
Patent
active
057773874
ABSTRACT:
Copper foil wiring is applied to base film and the wiring is in turn covered by a cover resist. The electrodes of a semiconductor IC chip is connected to the inner leads of the copper foil wiring and the semiconductor chip is then encapsulated by encapsulation resin. Solder balls are supplied to lands through openings in the cover resist, and bumps are formed. The four sides of the film are then folded to form folded portions. These folded portions increase the strength of the edges of the film, thereby reducing warping and waviness and allowing simultaneous mounting of other devices such as QFP to the substrate. The angle of folding with respect to the film surface is preferably 20.degree. or greater and less than 90.degree., and still greater strength can be obtained by two-stage folding of the sides.
REFERENCES:
patent: 4939570 (1990-07-01), Bickford et al.
patent: 4977441 (1990-12-01), Ohtani et al.
patent: 5075760 (1991-12-01), Nakashima et al.
Nikkei Microdevice Journal, pp. 58-64, Mar. 1994.
Yamashita Chikara
Yoshigai Akira
NEC Corporation
Thomas Tom
Williams Alexander Oscor
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