Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1999-02-03
2000-07-04
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257685, 257777, 257666, 257673, 257476, 257778, 361813, 361730, H01L 2302, H01L 23495, G06K 1907, G11C 504
Patent
active
060842946
ABSTRACT:
Electrodes of a semiconductor element are connected to lead wires provided on a flexible substrate, thereby forming a structural unit of a semiconductor element. A plurality of structural unit of a semiconductor elements are stacked on a mounting board, and the lead wires of each flexible substrate are electrically connected to wiring patterns on the package board. The stacked structure units of semiconductor elements are sealed on a package board through use of resin.
REFERENCES:
patent: 4160308 (1979-07-01), Courtney et al.
patent: 4523219 (1985-06-01), Heidegger et al.
patent: 5049527 (1991-09-01), Merrick et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5295045 (1994-03-01), Kitano et al.
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5708298 (1998-01-01), Masayuki et al.
patent: 5754408 (1998-05-01), Derouiche
patent: 5789815 (1998-08-01), Tessier
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5910685 (1999-06-01), Watanabe et al.
Mitsubishi Denki & Kabushiki Kaisha
Williams Alexander Oscar
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