Semiconductor device comprising porous film

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...

Reexamination Certificate

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Details

C257S522000, C257SE23002, C257SE23011

Reexamination Certificate

active

11652297

ABSTRACT:
The present invention provides a zeolite sol which can be formed into a porous film that can be thinned to an intended thickness by a method used in the ordinary semiconductor process, that excels in dielectric properties, adhesion, film consistency and mechanical strength, and that can be easily thinned; a composition for film formation; a porous film and a method for forming the same; and a high-performing and highly reliable semiconductor device which contains this porous film inside. More specifically, the zeolite sol is prepared by hydrolyzing and decomposing a silane compound expressed by a general formula: Si(OR1)4(wherein R1represents a straight-chain or branched alkyl group having 1 to 4 carbons, and when there is more than one R1, the R1s can be independent and the same as or different from each other) in a conventional coating solution for forming a porous film in the presence of a structure-directing agent and a basic catalyst; and then by heating the silane compound at a temperature of 75° C. or lower. A composition for forming a porous film which contains this zeolite sol is used.

REFERENCES:
patent: 5625108 (1997-04-01), Perego et al.
patent: 5792706 (1998-08-01), Michael et al.
patent: 5888466 (1999-03-01), Perego et al.
patent: 6573131 (2003-06-01), Yan et al.
patent: 1107803 (1995-09-01), None
patent: 1338427 (2002-03-01), None
patent: 1346790 (2002-05-01), None

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