Semiconductor device comprising an in-chip active heat...

Details Semiconductor device comprising an in-chip active heat... Semiconductor device comprising an in-chip active heat...

2011-04-12

2011-04-12

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S718000, C361S761000, C257S706000, C257S712000, C257S713000, C438S048000, C438S055000, C136S201000, C136S205000

Reexamination Certificate

active

07924569

ABSTRACT:
By providing thermoelectric elements, such as Peltier elements, in a semiconductor device, the overall heat management may be increased. In some illustrative embodiments, the corresponding active cooling/heating systems may be used in a stacked chip configuration to establish an efficient thermally conductive path between temperature critical circuit portions and a heat sink of the stacked chip configuration.

REFERENCES:
patent: 3766444 (1973-10-01), Bosch
patent: 5229643 (1993-07-01), Ohta et al.
patent: 5879630 (1999-03-01), Lescouzeres et al.
patent: 5956569 (1999-09-01), Shiu et al.
patent: 6230497 (2001-05-01), Morris et al.
patent: 6250085 (2001-06-01), Tousson
patent: 6281120 (2001-08-01), Strnad
patent: 6476483 (2002-11-01), Adler et al.
patent: 6525419 (2003-02-01), Deeter et al.
patent: 6559538 (2003-05-01), Pomerene et al.
patent: 6563227 (2003-05-01), Strnad
patent: 6588217 (2003-07-01), Ghoshal
patent: 6645786 (2003-11-01), Pomerene et al.
patent: 6646340 (2003-11-01), Deeter et al.
patent: 6717261 (2004-04-01), Voigtlaender et al.
patent: 6743972 (2004-06-01), Macris
patent: 6800933 (2004-10-01), Mathews et al.
patent: 7034394 (2006-04-01), Ramanathan et al.
patent: 7075133 (2006-07-01), Padmanabhan et al.
patent: 7250327 (2007-07-01), Sakamoto
patent: 7301233 (2007-11-01), Lee et al.
patent: 7338840 (2008-03-01), Padmanabhan et al.
patent: 7352003 (2008-04-01), Zhang
patent: 7537954 (2009-05-01), Ramanathan et al.
patent: 7544883 (2009-06-01), Chen et al.
patent: 7556869 (2009-07-01), Fukushima et al.
patent: 7656027 (2010-02-01), Dangelo et al.
patent: 2004/0251531 (2004-12-01), Yang et al.
patent: 2005/0121064 (2005-06-01), Seo
patent: 2006/0012033 (2006-01-01), Noguchi
patent: 2006/0102223 (2006-05-01), Chen et al.
patent: 2006/0118934 (2006-06-01), Ishikawa et al.
patent: 2006/0145356 (2006-07-01), Liu et al.
patent: 2007/0089773 (2007-04-01), Koester et al.
patent: 2007/0144182 (2007-06-01), Sauciuc et al.
patent: 2009/0079063 (2009-03-01), Chrysler et al.
patent: 2009/0321909 (2009-12-01), Gu et al.
patent: 101 32 763 (2007-10-01), None
patent: 112004002121 (2007-12-01), None
patent: 01245549 (1989-09-01), None
patent: 2003017638 (2003-01-01), None
patent: 02003017638 (2003-01-01), None
patent: WO 2009/158287 (2009-12-01), None
Translation of Official Communication from German Patent Office for German Patent Application No. 10 2008 049 726.6 dated Jul. 24, 2009.
PCT Search Report and Written Opinion from PCT/EP2009/006689 dated Apr. 27, 2010.
PCT Preliminary Report on Patentability from PCT/EP2009/006689 dated Oct. 26, 2010.

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