Semiconductor device comprising a semiconductor substrate, an el

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material

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Details

257787, 257788, 257791, 257642, H01L 2328, H01L 2102

Patent

active

056001517

ABSTRACT:
A semiconductor device having a stress-buffering film which is effective in buffering the stress caused by a molding resin during sealing, the stress-buffering film being made of a silicone ladder resin represented by formula (I) ##STR1## wherein each end group R may be the same or different and represents a hydrogen atom or an alkyl group, each side chain R' may be the same or different and represents a cyclohexyl group, a lower alkyl group, or a photopolymerizable unsaturated group, and n is an integer of 10 or larger.

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patent: 5057336 (1991-10-01), Adachi et al.
patent: 5081202 (1992-01-01), Adachi et al.
patent: 5180691 (1993-01-01), Adachi et al.
patent: 5183846 (1993-02-01), Aiba et al.
patent: 5278451 (1994-01-01), Adachi et al.
patent: 5306947 (1994-04-01), Adachi et al.

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