Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-02-01
2011-02-01
Tran, Minh-Loan T (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23169
Reexamination Certificate
active
07880285
ABSTRACT:
A semiconductor device includes a semiconductor chip stack having at least one lower semiconductor chip as a base of the semiconductor chip stack, and at least one upper semiconductor chip. An insulating intermediate plate is arranged between the semiconductor chips. Connecting elements wire the semiconductor chips, the intermediate plate and external terminals to one another.
REFERENCES:
patent: 4859631 (1989-08-01), Barre
patent: 5562837 (1996-10-01), De Givry
patent: 5898223 (1999-04-01), Frye et al.
patent: 6414384 (2002-07-01), Lo et al.
patent: 6437449 (2002-08-01), Foster
patent: 6603072 (2003-08-01), Foster et al.
patent: 6894381 (2005-05-01), Hetzel et al.
patent: 7166495 (2007-01-01), Ball
patent: 7271470 (2007-09-01), Otremba
patent: 2002/0027295 (2002-03-01), Kikuma et al.
patent: 2004/0056277 (2004-03-01), Karnezos
patent: 2004/0253762 (2004-12-01), Lee
patent: 2005/0090050 (2005-04-01), Shim et al.
patent: 2005/0124093 (2005-06-01), Yang et al.
patent: 2005/0263873 (2005-12-01), Shoji
patent: 2006/0118938 (2006-06-01), Tandy
patent: 2006/0261453 (2006-11-01), Lee et al.
patent: 2007/0176277 (2007-08-01), Brunnbauer et al.
“StakPak IGBT Press-packs: A new Packaging Concept for High Power Electronics,” ABB Semiconductors Inc., Apr. 2004.
Hosseini Khalil
Mahler Joachim
Cruz Leslie Pilar
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Tran Minh-Loan T
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