Semiconductor device comprising a chip which is provided with a

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Patent

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Details

257774, 257728, 333246, 333247, H01L 2348, H01L 2352, H01L 2940

Patent

active

058443215

ABSTRACT:
A semiconductor device comprises a chip soldered to a support. The chip comprises a semiconductor substrate, a via a ground plane on a rear surface, and an anti-adhesion layer deposited continuously inside the via. A solder layer which does not wet the anti-adhesion layer but which does wet the ground plane has a globular shape in the via opening and makes no mechanical contact with the walls of the via. The manufacturing process comprises the sandwiching of a soldering preform between the support and the rear surface provided with the ground plane and said anti-adhesion layer, and melting of the preform under pressure so that the solder rises in globular shape inside the via. The anti-adhesion layer is realized without mask.

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