Semiconductor device circuit board, and electronic equipment

Details Semiconductor device circuit board, and electronic equipment Semiconductor device circuit board, and electronic equipment

2006-06-20

2006-06-20

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257S777000, C257S784000

Reexamination Certificate

active

07064425

ABSTRACT:
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.

REFERENCES:
patent: 4845543 (1989-07-01), Okikawa et al.
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6559526 (2003-05-01), Lee et al.
patent: A 8-340018 (1996-12-01), None
patent: A 10-112471 (1998-04-01), None
patent: A 2001-118877 (2001-04-01), None
patent: A 2001-127246 (2001-05-01), None
patent: A 2001-284388 (2001-10-01), None
patent: A 2002-110898 (2002-04-01), None
patent: A 2002-280410 (2002-09-01), None
U.S. Appl. No. 10/327,968, filed Dec. 26, 2002, Tomimatsu.
U.S. Appl. No. 10/347,474, filed Jan. 21, 2003, Takahashi.
U.S. Appl. No. 10/347,297 filed Jan. 21, 2003, Takahashi.

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