Semiconductor device, circuit board, and electronic...

Details Semiconductor device, circuit board, and electronic... Semiconductor device, circuit board, and electronic...

2007-04-24

2007-04-24

Dickey, Thomas L. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE25013

Reexamination Certificate

active

10799743

ABSTRACT:
A semiconductor device includes a semiconductor device body section having a substrate and an electrode formed on the substrate. A through-hole is formed through the electrode and the substrate in a stacking direction of the electrode and the substrate, and a conductive member is inserted into the through-hole. An insulating material which faces at least the through-hole is formed on the electrode. The conductive member is formed over the insulating material from the through-hole and is connected with the electrode.

REFERENCES:
patent: 6563079 (2003-05-01), Umetsu et al.
patent: 6608371 (2003-08-01), Kurashima et al.
patent: 2001/0027011 (2001-10-01), Hanaoka et al.
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 2002/0025587 (2002-02-01), Wada
patent: 2002/0151169 (2002-10-01), Umetsu et al.
patent: 2003/0210534 (2003-11-01), Swan et al.
patent: A 2002-50738 (2002-02-01), None
Miyazawa, Ikuya et al. “Development of Die Level Stacked Packaging.” International Conference on Electronic Packaging Official Program 2003.
U.S. Appl. No. 10/799,621, filed Mar. 15, 2004, Masuda.

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