Semiconductor device, circuit board and electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Reexamination Certificate

active

06995476

ABSTRACT:
A method of manufacturing a semiconductor device, comprising: a first step of interposing an anisotropic conductive material16between a surface18of a substrate12on which an interconnect pattern10is formed, and a surface24of a semiconductor chip20on which electrodes22is formed; and a second step in which pressure is applied between the semiconductor chip20and the substrate12, the interconnect pattern10and electrodes22are electrically connected, and the anisotropic conductive material16is caused to surround at least a part of a lateral surface28of the semiconductor chip20.

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