Semiconductor device, chip package and method of fabricating...

Details Semiconductor device, chip package and method of fabricating... Semiconductor device, chip package and method of fabricating...

2007-06-13

2010-12-28

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S107000, C438S109000, C438S110000, C438S111000, C438S112000, C438S113000, C438S114000, C438S115000, C438S116000, C438S117000, C438S118000, C438S119000, C438S120000, C438S121000, C438S122000, C438S123000, C438S124000, C438S125000, C438S126000, C257S733000, C257S734000, C257S735000, C257S736000, C257S737000

Reexamination Certificate

active

07858438

ABSTRACT:
A semiconductor device has a chip, a first bump electrode, a conductive wire and a second bump electrode. The chip has at least one contact pad, and the first bump electrode is formed on the contact pad. The conductive wire is disposed on an active surface of the chip and electrically connected to the first bump electrode. The second bump electrode is formed on the conductive wire, and the second bump electrode is not disposed over any contact pad of the chip. In addition, a method for packaging a chip and an IC package are also disclosed.

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