Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1997-07-24
1999-03-23
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257678, H01L 2302
Patent
active
058864024
ABSTRACT:
A semiconductor device card receiving a circuit substrate (1) which has electronic component parts (2) assembled therein, comprises a pair of metal sheets (10, 10) forming a front and a back surfaces of the card and a pair of opposed resin-made frames (11, 12) surrounding peripheries of the respective metal sheets to be connected by embedding bent portions 100 of the peripheries of the metal sheets (10, 10) into the resin-made frames (11, 12), and the paired opposed frames are provided at their contact end portions with fusible projections (13) and grooves (14) adapted to engage with the projections (13) and are connected to each other by fusing at least a leading end of the projection (13) within the groove (14). A plurality of projecting portions (10a) are projected downward from the bent portions (100) of one of the paired metal sheets 10 and engaging portions (10b) adapted to engage with the projecting portions (10a) are formed in the bent portions (100) of the opposite metal sheet (10), so that the paired sheet metals can be electrically conducted to each other by the engagement between the projecting portions (10a) and the engaging portions (10b) and the connection of the opposed side frames can be reinforced. The connecting strength can be improved by employing an ultrasonic bonding. While the number of the components parts can be decreased, the connecting strength can be further improved.
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Morii Tomomi
Onoda Shigeo
Chaudhuri Olik
Kelley Nat
Mitsubishi Denki & Kabushiki Kaisha
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