Semiconductor device capsule

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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C257S719000, C257SE23110

Reexamination Certificate

active

11149573

ABSTRACT:
A semiconductor device capsule comprising a semiconductor assembly mounted between opposed poles. At least one of the poles includes slots around the locality of the or each chip or group of chips within the semiconductor assembly to define a contact body portion on which the or each chip or group of chips is mounted and reduce the thickness of a laterally continuous body portion of the pole.

REFERENCES:
patent: 5866944 (1999-02-01), Hiyoshi et al.
patent: 6373133 (2002-04-01), DiGiacomo et al.
patent: 6490161 (2002-12-01), Johnson
patent: 6552266 (2003-04-01), Carden et al.
patent: 2004/0021149 (2004-02-01), Kitazawa et al.
patent: 09-275186 (1997-10-01), None

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