Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-10-23
2007-10-23
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S719000, C257SE23110
Reexamination Certificate
active
11149573
ABSTRACT:
A semiconductor device capsule comprising a semiconductor assembly mounted between opposed poles. At least one of the poles includes slots around the locality of the or each chip or group of chips within the semiconductor assembly to define a contact body portion on which the or each chip or group of chips is mounted and reduce the thickness of a laterally continuous body portion of the pole.
REFERENCES:
patent: 5866944 (1999-02-01), Hiyoshi et al.
patent: 6373133 (2002-04-01), DiGiacomo et al.
patent: 6490161 (2002-12-01), Johnson
patent: 6552266 (2003-04-01), Carden et al.
patent: 2004/0021149 (2004-02-01), Kitazawa et al.
patent: 09-275186 (1997-10-01), None
Ballad John
Goode Andrew
Areva T&D SA
Pert Evan
Sandvik Benjamin P.
Thelen Reid Brown Raysman & Steiner LLP
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