Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1997-08-06
1999-11-23
Monin, Jr., Donald L.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438118, 438123, 438124, 438126, H01L 2156
Patent
active
059899409
ABSTRACT:
In a method of manufacturing a semiconductor device including a semiconductor element and a chip carrier which has conductive leads bonded to the semiconductor element, a first resin mold portion is formed by a first resin mold portion to locate inner parts of the conductive leads together with the semiconductor element within the first resin mold portion. Thereafter, a second resin mold portion is formed to cover the first resin mold portion on a side of the semiconductor element and to uncover the first resin mold portion on another side opposite to the semiconductor element. Alternatively, a heat spreader may be attached to the semiconductor element and may be sealed by the first and the second resin mold portions.
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Chambliss Alonzo
Monin, Jr. Donald L.
NEC Corporation
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