Semiconductor device based on Si-Ge with high stress liner...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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C257S018000

Reexamination Certificate

active

07053400

ABSTRACT:
The carrier mobility in transistor channel regions of Si—Ge devices is increased by employing a stressed liner. Embodiments include applying a high compressive or tensile stressed film overlying relaxed source/drain regions. Other embodiments include applying a high compressively or high tensilely stressed film, after post silicide spacer removal, over gate electrodes and strained Si source/drain regions of P-channel or N-channel transistors, respectively.

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patent: 2004/0045499 (2004-03-01), Langdo et al.
patent: 2005/0224867 (2005-10-01), Huang et al.
Semiconductor one source definition of silicide and silicidation from semiconductorglossary.com.
S.E. Thompson et al., “A Logic Nanotechnology Featuring Strained-Silicon” IEEE Electron Device Letters, IEEE Inc. New York, US, vol. 25, No. 4, Apr. 2004, pp. 191-193, XP001190370.
T. Ghani et al., “A 90nm High volume Manufacturing Logic Technology Featuring Novel 45nin Gate Length Strained Silicon CMOS Transistors” International Electron Devices Meeting 2003, IEDM, Technical Digest, Washington, Dc, Dec. 8, 2003, pp. 978-980, XP010684238.
S. Thompson et al., “A 90nm Logic TechnologyFeaturing 50nm Strained Silicon Channel Transistors, 7 Layers of Cu Interconnects, Low K 1LD, and 1/spl mu/m <2>. SRAM Cell”, International Electron Devices Meeting 2002. IEDM Technical Digest, San Francisco, CA, Dec. 8-11, 2002, New York, NY: IEEE, US, Dec. 8, 2002, pp. 61-64, XP010625990.

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