Semiconductor device balancing thermal expansion coefficient mis

Details Semiconductor device balancing thermal expansion coefficient mis Semiconductor device balancing thermal expansion coefficient mis

1997-05-06

1998-05-12

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 257706, 257724, 361719, H05K 720

Patent

active

057515522

ABSTRACT:
A hybrid multi-chip module includes semiconductor chips (27, 31) bonded to a base plate (24). The base plate includes a substrate (11) having two surfaces (12, 13) and a conductive material (16) molded on the two surfaces (12, 13). A coefficient of thermal expansion (CTE) mismatch between the substrate (11) and the conductive material (16) at the first surface (12) is balanced by a similar, but opposite, CTE mismatch between the substrate (11) and the conductive material (16) at the second surface (13). The CTE mismatch balance across the base plate (24) produces a base plate (24) having a substantially planar form at high temperatures.

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