Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-10-24
1999-04-20
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257691, 257698, 257734, H01L 2348
Patent
active
058959688
ABSTRACT:
A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed on one surface of a printed wring board and is divided into electrically insulated conductive segments. Each of the conductive segments is connected to an external connection, and includes one or more interconnects that can be directly connected to a semiconductor die. The conductive segments are surrounded by an array of bond fingers which serve to connect the semiconductor die to further external connections, such as signal connections. The present invention is especially advantageous in the fabrication of pin grid array (PGA) and ball grid array (BGA) type integrated circuit packages.
REFERENCES:
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 5036163 (1991-07-01), Spielberger
patent: 5105257 (1992-04-01), Michii
Chaudhuri Olik
Dietrich Michael
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