Semiconductor device assembly with improved fatigue resistance

Details Semiconductor device assembly with improved fatigue resistance Semiconductor device assembly with improved fatigue resistance

1976-12-09

1978-06-06

James, Andrew J.

357 79, 357 81, 357 65, H01L 2348, H01L 2944, H01L 2952

Patent

active

040939588

ABSTRACT:
A semiconductor diode package which permits improved thermal and mechanical connection in soldered assemblies. Structural features which result in this improvement comprise double contacting studs having tapered end portions and an area somewhat larger than the semiconductor diode, and an organic encapsulant which seals the diode and the ends of the studs soldered to the diode while leaving the tapered ends of the studs exposed.

REFERENCES:
patent: 3573574 (1971-04-01), Davis
patent: 3686541 (1972-08-01), Livezey
patent: 3789248 (1974-01-01), Jaecklin et al.
patent: 3875438 (1975-04-01), Tharman
patent: 4008487 (1977-02-01), Vogt

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