Semiconductor device assembly process

Details Semiconductor device assembly process Semiconductor device assembly process

2011-06-14

2011-06-14

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000, C257S676000, C257SE21499, C257SE23001

Reexamination Certificate

active

07960209

ABSTRACT:
A Conductive Epoxy Coating (“CEC”) process is provided for assembling semiconductor devices. The CEC process includes application of a conductive epoxy coating prior to wafer dicing and instead of dispensing epoxy/solder when performing die bonding. The CEC process generally begins with a silicon wafer. Processing of the silicon wafer includes coupling a conductive epoxy layer to a first side of the semiconductor wafer to form a coated wafer. The process cures the coated wafer and forms die from the coated wafer. The process further couples an exposed side of the conductive epoxy layer of the die to a lead frame to form a semiconductor device, and cures the semiconductor device.

REFERENCES:
patent: 4803545 (1989-02-01), Birkle
patent: 5350713 (1994-09-01), Liang
patent: 5572069 (1996-11-01), Schneider
patent: 5834842 (1998-11-01), Majumdar et al.
patent: 6303978 (2001-10-01), Daniels et al.
patent: 6351034 (2002-02-01), Farnworth et al.
patent: 6396127 (2002-05-01), Munoz et al.
patent: 6587344 (2003-07-01), Ross
patent: 6608373 (2003-08-01), Wu et al.
patent: 6638789 (2003-10-01), Glenn et al.
patent: 6765652 (2004-07-01), Jiang
patent: 6767757 (2004-07-01), Kang et al.
patent: 6780746 (2004-08-01), Kinsman et al.
patent: 2002/0140093 (2002-10-01), Yamazaki et al.
patent: 2002/0180059 (2002-12-01), Shibata
patent: 2003/0001107 (2003-01-01), Kroon et al.
patent: 2004/0130013 (2004-07-01), Sunohara et al.
patent: 2004/0195701 (2004-10-01), Attarwala
patent: 2005/0148160 (2005-07-01), Farnworth et al.

Affiliated with

Also associated with

Rating

Semiconductor device assembly process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device assembly process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device assembly process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2675077