Semiconductor device assembly and method thereof

Details Semiconductor device assembly and method thereof Semiconductor device assembly and method thereof

2009-03-02

2011-11-01

Blum, David S (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE21499, C257SE23068

Reexamination Certificate

active

08049321

ABSTRACT:
A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.

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patent: 2010/0255637 (2010-10-01), Ishida et al.
patent: 1498423 (2004-05-01), None
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