Semiconductor device assembly and method of making same

Details Semiconductor device assembly and method of making same Semiconductor device assembly and method of making same

1986-07-16

1989-01-10

Edlow, Martin H.

357 74, H01L 2302

Patent

active

047977280

ABSTRACT:
The invention is a semiconductor device assembly and method of making the same. A mounting plate has positioning means for positioning the plate relative to a header, a first mounting surface of the plate is attached to the header and a semiconductor device is attached to a second mounting surface of the mounting plate. The assembly is made by forming the mounting plate, positioning the mounting plate relative to the header by the positioning means, attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. Another method of making the assembly is by defining and etching a mounting plate and attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. This assembly and process provides an efficient means for mounting semiconductor devices and in particular electro-optic devices such as lasers.

REFERENCES:
patent: 4240090 (1980-12-01), Hughes et al.
patent: 4240098 (1980-12-01), Zory et al.
patent: 4394679 (1983-07-01), Hawrylo

Affiliated with

Also associated with

Rating

Semiconductor device assembly and method of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device assembly and method of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device assembly and method of making same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2110977