Wave transmission lines and networks – Transmission line inductive or radiation interference...
Reexamination Certificate
2011-08-02
2011-08-02
Pascal, Robert (Department: 2817)
Wave transmission lines and networks
Transmission line inductive or radiation interference...
C333S204000, C333S247000
Reexamination Certificate
active
07990228
ABSTRACT:
A technique capable of achieving both improvement of mounting density and noise reduction for a semiconductor device is provided. An LSI mounted on a printed wiring board comprises a grounding BGA ball and a power BGA ball to get power supply from the printed wiring board, and the grounding BGA ball and the power BGA ball are arranged closely to each other. A decoupling capacitor is mounted on the printed wiring board and has a first terminal and a second terminal. The grounding BGA ball and the first terminal are connected by a first metal electrode plate, and the power BGA ball and the second terminal are connected by a second metal electrode plate. The first metal electrode plate and the second metal electrode plate interpose a dielectric film having a thickness equal to or smaller than 1 μm therebetween.
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Nishio Yoji
Osaka Hideki
Suzuki Eiichi
Uematsu Yutaka
Antonelli, Terry Stout & Kraus, LLP.
Elpida Memory Inc.
Glenn Kimberly E
Hitachi , Ltd.
Pascal Robert
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