Semiconductor device and wiring body

Details Semiconductor device and wiring body Semiconductor device and wiring body

1998-03-23

2000-03-21

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257690, 257691, 257702, 257676, 257776, H01L 23495, H01L 2348, H01L 2352

Patent

active

060406216

ABSTRACT:
A semiconductor device is provided with a wiring body including an insulating supporting substrate, and signal lines, power lines and ground lines printed on first and second surfaces of the insulating supporting substrate. The wiring body is mounted on a semiconductor chip, inside pads of the lines of the wiring body are connected with bonding pads on the semiconductor chip through first metal lines, and outside pads of the lines are connected with leads of a lead frame. Since the wiring body has a structure in which the lines are supported by the insulating supporting substrate, refined and various line patterns can be formed by using the wiring body, and an impedance matching function can also be attained. Thus, the invention provides a semiconductor device which can exhibit high noise resistance for a high frequency signal and a high operation speed and a wiring body to be disposed in a high frequency circuit.

REFERENCES:
patent: 4720690 (1988-01-01), Popek et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5523622 (1996-06-01), Harada et al.
patent: 5559316 (1996-09-01), Tomoda
patent: 5872393 (1999-02-01), Sakai et al.

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