Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-01-13
2009-06-23
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S532000, C257S737000
Reexamination Certificate
active
07550837
ABSTRACT:
A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.
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Kimura Keiichi
Takai Masami
Dickstein & Shapiro LLP
Nguyen Cuong Q
Ricoh & Company, Ltd.
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